PARQIT Low Shrinkage Epoxy Adhesive
A light-curing resin with low curing shrinkage that is not affected by positional displacement!
It is suitable for applications where positional misalignment of lenses, holders, fine optical components, sensors, fibers, etc., is a concern. Liquid-curable resins shrink in volume when they change from liquid to solid during the curing reaction. This is called curing shrinkage, and in precision bonding, it can cause issues such as optical axis misalignment and positional displacement. Generally, the curing shrinkage rate of epoxy resins is about 3-5%, and even types containing inorganic fillers have a shrinkage of about 2%. This phenomenon is not limited to epoxy resins; it is also observed in acrylate resins, which typically have a higher shrinkage rate than epoxy, shrinking about 5-10%. The epoxy-based precision adhesive developed by our company contains inorganic fillers and includes types with a curing shrinkage rate below 1%, types with a linear expansion coefficient of 4-7×10^-5, and various curing wavelengths of 300 nm, 360 nm, 405 nm, as well as visible light curing types. *For more details, please download the catalog or contact us.*
- Company：オーテックス
- Price：Other
